A secret technology opens the way for the thinnest iPhone in history

The company has abandoned traditional solder balls                                                   

A secret technology opens the way for the thinnest iPhone in history

Apple is racing to launch its highly anticipated iPhone 17 Air, which leaks indicate will be the thinnest phone in the company's history, measuring no more than 5.5 mm thick. However, this ultra-slim design poses complex challenges, most notably the heat generated by the powerful processor and the limited battery space. Apple has an innovative engineering technology known as Copper Post, developed by LG Innotek.

Instead of traditional solder balls that connect the chip to the motherboard, this technology uses tiny copper posts with a small solder ball at the top, reducing the size of the semiconductor substrate by up to 20%. This change, though simple, has a significant impact: it allows for tighter contact between internal components and helps dissipate heat more efficiently, enabling Apple to maintain the performance of the powerful A19 Pro chip within an ultra-thin body without compromise.

Experimental Pre-Generalization

The technology isn't entirely new to Apple, as it was first used in a SIM card inside the iPhone 16e this year. Following successful testing, it appears the company has decided to adopt it for its upcoming iPhone 17 Air.

OLED Displays from Samsung and LG

In addition to thermal solutions, the phone will rely on an advanced, low-power LTPO OLED display, supplied by both Samsung and LG. Analysts believe that the Copper Post technology may not be limited to the iPhone 17 Air, but could be a pivotal element in the development of Apple's first foldable phone, as the need to manage heat and space becomes more pressing.